Solder paste is roughly 88% metal powder by weight, so the powder sets the ceiling on how a paste prints, wets and joins. Every tinvoa paste starts with ultrasonic-atomized powder made by Lingsko, the company behind tinvoa.
Shape, oxide and size distribution decide how cleanly a paste leaves the stencil or syringe, how readily it wets, and how repeatable each deposit is.
Near-perfect spheres roll past one another cleanly — for smooth stencil release and clog-free dispensing.
Low surface oxide leaves less for the flux to clean up — for strong wetting and bright, reliable joints.
A tight size distribution — for consistent, repeatable deposit volume from board to board.
Typical values are not specifications. Confirm against the certificate of analysis supplied with your lot.
Ultrasonic atomization uses high-frequency vibration, rather than a high-pressure gas jet, to break up the melt. The process is known for a narrower particle-size distribution than conventional gas atomization, with fewer irregular and satellite particles.
The alloy is melted to a controlled composition within IPC J-STD-006C ranges.
The molten alloy is fed onto a surface vibrating at ultrasonic frequency, which breaks it into fine, uniform droplets. Surface tension pulls each droplet into a sphere as it solidifies.
The powder is classified to the IPC J-STD-005A particle-size type of the paste it goes into — Type 4 or Type 5.
The powder is blended with no-clean flux, and the finished paste is evaluated using IPC J-STD-005A test methods.
Lingsko is the company behind tinvoa. Every tinvoa solder paste starts as Lingsko ultrasonic-atomized powder, so the powder in your syringe comes from a source we control.
Lingsko LLC owns the tinvoa™ trademark and makes the powder that goes into every tinvoa paste. One supply chain from atomizer to syringe means the powder type, alloy and lot behind your paste are always traceable.
Ask about powder type, alloy, or fit for your stencil and dispenser — or request wholesale pricing.