Home/Products/No-Clean Tacky Flux
tinvoa No-Clean Tacky Flux — high-tack halide-free rosin paste, 10cc syringe
No-Clean High-Tack Rosin Flux · ROL0

No-Clean Tacky Flux

High-tack rosin paste · ROL0 · Halide-free
10cc syringeHolds componentsHalide-freeRoom-temp storageBGA reballing
$13.99/ syringe
Buy now Buy on Amazon Request Wholesale Quote

Ships from our U.S. warehouse · $4.99 flat shipping · Free on orders of $49.99+ with code FREESHIP at checkout · Shipping & returns

  • Same ROL0 chemistry class as our standard flux — higher solids
  • Engineered to hold parts through the ramp, not just wet the joint
  • Tack force evaluated using the IPC-TM-650 2.4.44 method (adapted)
  • Room-temperature storage · 12-month shelf life
  • SKU TFX-RT-10CC · standard flux is TFX-RO-10CC
Two Grades

Same chemistry class. Different job.

Both are ROL0 — IPC J-STD-004B classifies flux by chemical activity, and it says nothing about tack. So the two grades sit in the same classification and do genuinely different work. Pick by whether something has to stay put while it heats.

Standard — No-Clean Soldering FluxTacky — No-Clean Tacky Flux
SKUTFX-RO-10CCTFX-RT-10CC
ClassificationROL0 (IPC J-STD-004B)ROL0 (IPC J-STD-004B)
Solids content68–72% (typical)72–76% (IPC 2.3.34)
Tack forceNot specifiedEvaluated by IPC-TM-650 2.4.44 (adapted)
Holds a part through ramp-upNo — not designed for itYes — that is the point
Best forTouch-up, wire tinning, desoldering & wick clean-up, chip/component rework, general board repairBGA / QFN / LGA reballing, holding components through reflow, stencil printing, pin transfer, fine-pitch rework
Price$9.99$13.99
StatusAvailableAvailable

If you are tinning wire, cleaning up a bridge, or reflowing a part that is already held by its own leads, the standard grade is the right one and it costs less. Reach for the tacky grade when gravity, airflow or a bumped board would otherwise move the part before the solder melts.

Common Uses

Built to hold.

Every use below shares one requirement: something must not move between placement and reflow.

BGA / QFN Reballing

Holds the ball array to the stencil and the package to the board through the ramp. This is the job that tack exists for — a standard flux paste lets balls roll.

Component Hold Through Reflow

Tacks chips, connectors and shields in position on a hot plate or in a reflow oven, so a tilted board or hot-air blast does not shift them before the joint forms.

Stencil Printing & Pin Transfer

Higher solids and thixotropic body give clean release from apertures and a controlled dot on transfer pins, without slumping between print and placement.

Fine-Pitch Rework

Stays where it is placed on tight pitch instead of wicking across the pad field, so the flux is under the joint you are working on and not the three beside it.

Single-Ball & Preform Repair

Replacing one missing or damaged ball on a BGA, or setting a solder preform on a pad: a dab of flux under it keeps that ball or preform in place until it wets, with no stencil needed.

Flux-Dip Placement (PoP / CSP)

Spread a thin, even film, dip the ball side of a package-on-package top part or CSP, then place it. The flux it picks up stays on the balls and holds the part down as you set it.

How We Define It

“Tacky” is a measurement, not an adjective.

Every brand in this category prints the word. Almost none publishes a number behind it — because IPC J-STD-004B, the standard that governs flux, has no tack requirement at all. Tack is a solder-paste property, defined in the J-STD-005A family. We evaluate tack with that method anyway, and state the method number beside every figure we publish.

IPC-TM-650 2.4.44

Tack force

A probe is pressed into the deposit and withdrawn; the peak force required is the tack, reported in gf. The method is written for solder paste, so for a flux-only product it is applied as an adapted method — which we state alongside the value rather than quietly omit.

IPC-TM-650 2.3.34

Solids content

The physical origin of tack. A liquid flux runs about 4% solids; a paste like ours runs near 70%. The tacky grade goes higher still — that is the lever behind the tack.

Rotational viscometry

Viscosity & thixotropic index

Reported with the spindle and speed, plus the low-speed / high-speed ratio. This is what decides whether the paste pushes cleanly out of a syringe yet refuses to slump once it is on the board.

IPC-TM-650 2.3.28.1 · 2.3.32 · 2.6.15 · 2.6.3.7

The reliability set, unchanged

Halide content by ion chromatography, copper mirror, copper corrosion and SIR — the methods that define ROL0 residue reliability. Higher tack must not cost you residue reliability, so this grade is specified to the same methods as the standard grade.

Technical Specifications

Complete spec sheet.

Typical values are not specifications. Lot-specific data available on request.

Product nameNo-Clean Tacky Flux
SKUTFX-RT-10CC
Flux typeNo Clean
Flux classificationROL0 (IPC J-STD-004B)
Flux baseRosin / modified resin, high solids
Activator systemLow activity, halogen-free organic activators
AppearanceAmber, translucent, non-slumping tacky paste
Solids content72–76% by weight (IPC 2.3.34)
Tack forceEvaluated using IPC-TM-650 2.4.44, applied as an adapted method (2.4.44 is written for solder paste). Data available on request.
Halide contentHalide-free — <0.05% by weight in flux solids (IPC-TM-650 2.3.28.1, ion chromatography) — ROL0 per IPC J-STD-004B.
Halogen contentHalogen-free — no intentionally added halogens.
Reflow profileRamp 1–2°C/s · dwell 1–2 min at 135–160°C (SAC, Sn-Pb) or 100–130°C (Sn42/Bi58) · peak and TAL per your alloy’s TDS
Application methodsDot dispensing · syringe · stencil printing · pin transfer · BGA reballing · rework soldering
Net contentNET WT 0.35 oz (10 g) · 10 cc syringe
Storage10–32°C (50–90°F), no refrigeration required
Shelf life12 months unopened from date of manufacture / 6 months after opening.
Thermal Profile

Activation window, peak set by your alloy.

A flux has no melting point, so there is no single reflow curve to publish. For SAC and tin-lead alloys, dwell at 135–160°C; Sn42/Bi58, often used for reballing, melts at 138°C, so soak it at 100–130°C instead. The peak is set by the solder you pair it with. Tack holds the part in place across that whole ramp.

Flux activation window · SAC / Sn-Pb
135–160 °C
Dwell 1–2 min in this range — the rosin activates, strips oxides and wets the surface just before the alloy melts. For Sn42/Bi58, soak at 100–130°C instead. Tack is what stops the part moving before you get here.
Ramp 1–2 °C/sDwell 1–2 minCool 3–7 °C/s
Peak temperature · set by your alloy
Sn42/Bi58 Low-temp bismuth
~160–170 °C
Sn63/Pb37 Leaded eutectic
~200–225 °C
SAC305 / SAC0307 Lead-free
~235–250 °C

Peaks are typical references — follow your alloy’s TDS and validate on your own thermal-mass test board. Full flux parameters in the TDS below ↓.

Safety & Hazard Information

GHS hazard communication.

High-tack rosin-based ROL0 no-clean flux paste. Classified under OSHA HazCom 2024 (GHS). Refer to the product SDS for the complete, authoritative classification.

GHS07
Irritant / Sensitizer
Signal word: WARNING

Hazard statements

  • H315 · Causes skin irritation.
  • H317 · May cause an allergic skin reaction (rosin / colophony).
  • H319 · Causes serious eye irritation.
  • H335 · May cause respiratory irritation.

Precautionary statements

  • P261 / P271 · Avoid breathing fumes; use only in a well-ventilated area.
  • P280 · Wear protective gloves and eye protection.
  • P302+P352 · IF ON SKIN: Wash with plenty of water.
  • P305+P351+P338 · IF IN EYES: Rinse cautiously with water. Remove contact lenses, if present and easy to do.
  • P333+P313 / P337+P313 · If skin or eye irritation persists: Get medical advice.
  • P501 · Dispose of contents / container per local regulations.

Keep out of the reach of children. California Proposition 65: rosin (colophony) is not a listed chemical; no warning is required. Safety Data Sheet available on request ↓

Compliance & Documents

Full QA paperwork.

Data behind the spec sheet is available on request.

Technical
Technical Data Sheet (TDS)

Full spec and the IPC method behind each figure.

View document
Process
Instructions for Use (IFU)

Step-by-step guide for BGA reballing, holding parts through reflow, and fine-pitch rework.

View document
Safety
Safety Data Sheet (SDS)

GHS classification, handling, storage, disposal — provided on request.

Request document
Quality
Certificate of Conformance (CoC)

Lot-traceable statement of conformance to this product's specification. Issued per lot with wholesale orders.

Request document
FAQ

Tacky flux — questions.

What's the difference between tacky flux and regular no-clean flux?

Tack, not activity. Both are ROL0 rosin fluxes, but tacky flux has higher solids (72–76% vs 68–72%) and a non-slumping body, so it holds BGAs, QFNs and chips in place through the reflow ramp. For general rework, the standard No-Clean Soldering Flux is enough.

Can I use tacky flux for BGA reballing?

Yes. It is made for BGA reballing, dot dispensing, syringe application, stencil printing, pin transfer and rework. Dwell 1–2 minutes at 135–160°C for SAC and tin-lead, or 100–130°C for Sn42/Bi58, and let the solder alloy set the peak.

How should I store tacky flux?

At room temperature, 10–32°C (50–90°F); no refrigeration is needed. Shelf life is 12 months unopened from the date of manufacture and 6 months after opening.

Flux that actually
holds.

Room-temperature storage, a 12-month shelf life, and a tack force defined by an IPC method, not an adjective. Ships from our U.S. warehouse — $4.99 flat, free on orders of $49.99+ with code FREESHIP.

Buy now See the Standard Grade